Microchip Technology DM183037 Data Sheet

 2012 Microchip Technology Inc.

DS30575A-page 629

Ambient temperature under bias.............................................................................................................-40°C to +100°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on MCLR with respect to V

SS

.......................................................................................................... -0.3V to 5.5V

Voltage on any digital only I/O pin with respect to V

SS

 (except V

DD

)........................................................... -0.3V to 5.5V

Voltage on any combined digital and analog pin with respect to V

SS

 (except V

DD

 and MCLR)...... -0.3V to (V

DD

 + 0.3V)

Voltage on V

BAT

 with respect to V

SS

.........................................................................................................  -0.3V to 3.66V

Voltage on V

USB

3V3

 with respect to V

SS

........................................................................................ (V

DD

 – 0.3V) to +4.0V

Voltage on V

DD

 with respect to V

SS

..........................................................................................................  -0.3V to 3.66V

Voltage on D+ or D- with respect to V

SS

 – 0W source impedance (Note 

)............................ -0.5V to (V

USB

3V3

 + 0.5V)

Source impedance 

 28W, V

USB

3V3

 

 3.0V).............................................................................................. -1.0V to +4.6V

Total power dissipation (Note 

) ..................................................................................................................................1W

Maximum current out of V

SS

 pin ...........................................................................................................................300 mA

Maximum current into V

DD

 pin ..............................................................................................................................250 mA

Input clamp current, I

IK

 (V

I

 < 0 or V

I

 > V

DD

) ..........................................................................................................±20 mA

Output clamp current, I

OK

 (V

O

 < 0 or V

O

 > V

DD

) .................................................................................................. ±20 mA

Maximum output current sunk by any I/O pins........................................................................................................25 mA
Maximum output current sourced by any I/O pins...................................................................................................25 mA
Maximum current sunk by

all ports combined.......................................................................................................200 mA

Maximum current sourced by all ports combined..................................................................................................200 mA

Note 1: Power dissipation is calculated as follows: 

Pdis = V

DD

 x {I

DD

 – 

 I

OH

} + 

 {(V

DD

 – V

OH

) x I

OH

} + 

(V

OL

 x I

OL

)

2: The original “USB 2.0 Specification” indicated that USB devices should withstand 24-hour short circuits of

D+ or D- to V

BUS

 voltages. This requirement was later removed in an engineering change notice (ECN) sup-

plement to the USB specifications, which supersedes the original specifications. PIC18F97J94 family
devices will typically be able to survive this short circuit test, but it is recommended to adhere to the absolute
maximum specified here to avoid damaging the device.    

†

NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the 
device. This is a stress rating only and functional operation of the device at those or any other conditions above 
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions 
for extended periods may affect device reliability.