Microchip Technology AC164331 Data Sheet
PA
G
E
3
4
Cu
rre
n
t An
alo
g
/In
te
rf
ac
e
Fa
mil
y
Pr
oduc
ts
INT
E
RF
ACE – L
IN T
ra
n
sc
eive
r Produc
ts
Pa
rt
#
D
es
cr
ip
ti
on
V
re
g
Ou
tp
u
t
V
o
lt
a
g
e
(V
)
Op
e
ra
tin
g
T
e
m
p
e
rat
u
re R
a
n
g
e
(°
C
)
V
re
g
O
u
tp
ut
Cur
re
nt
(m
A
)
V
CC
Ra
ng
e
(V
)
M
a
x
Ba
ud
Ra
te
L
IN Sp
e
c
ific
a
tio
n
S
u
pp
or
te
d
P
a
cka
ge
s
M
C
P
201
L
IN
T
rans
cei
v
e
r
w
it
h i
n
te
gr
a
te
d
V
RE
G
4.
7
5
t
o
5.
25
-4
0 t
o
+
1
25
50
7
.4 t
o
18
(1)
2
0
Kb
au
d
R
ev
is
io
n
1.
2
8
-p
in
P
D
IP
, 8-
pi
n
S
O
IC
, 8
-P
in D
F
N
N
O
T
E
1
:
Ca
n
with
s
ta
n
d
4
0
V
lo
a
d
d
u
m
p
.
IN
T
E
R
F
A
C
E
– S
e
ri
al
Per
iph
er
als
P
a
rt
#
D
es
cr
ip
ti
o
n
O
p
e
rat
in
g
V
o
lt
ag
e
(V
)
Op
e
ra
ti
n
g
T
e
m
p
e
rat
u
re R
a
n
g
e
(°C)
Bu
s
T
y
p
e
M
ax.
B
u
s
F
req
ue
nc
y
(k
Hz
)
Fe
at
u
res
Pa
ck
ag
es
M
C
P
230
08
8
-b
it
I/O
Po
rt
Ex
pand
er
1.
8 t
o
5
.5
-4
0
to
+8
5
I
2
C™
17
00
3
H
W
ad
dr
es
s
pi
ns
,
H
W
i
n
te
rr
up
t,
25
m
A
s
o
u
rc
e
/s
in
k ca
pab
ili
ty pe
r
I/
O
1
8
-P
in
PD
IP
, 1
8
-Pi
n
SOIC,
2
0
-Pi
n
SSOP
MCP2
3
S
0
8
8
-b
it
I/O
Po
rt
Ex
pand
er
1
.8
t
o
5.
5
-4
0
t
o
+
8
5
S
P
I
10
00
0
2
H
W
ad
dr
es
s
pi
ns
,
H
W
i
n
te
rr
up
t,
25
m
A
s
o
u
rc
e
/s
in
k ca
pab
ili
ty pe
r
I/
O
1
8
-P
in
PD
IP
, 1
8
-Pi
n
SOIC,
2
0
-Pi
n
SSOP
M
C
P
230
16
1
6
-b
it
I
/O
P
o
rt
E
x
pan
de
r
2.
0 t
o
5
.5
-4
0
to
+8
5
I
2
C™
40
0
3 H
/W ad
dr
e
ss i
npu
ts
, H
W
i
n
te
rr
upt
,
25
m
A
s
o
u
rc
e
/s
in
k ca
pab
ili
ty pe
r
I/
O
2
8
-P
in
PD
IP
, 2
8
-Pi
n
SOIC,
2
8
-Pi
n
SSOP
,
28
-P
in
6x
6 Q
F
N
M
C
P
230
17
1
6
-b
it
I
/O
ex
p
a
nd
er
1
.8
t
o
5.
5
-40
t
o
+
1
25
I
2
C™
1,
70
0
3
H
W
ad
dr
es
s
pi
ns
,
25
m
A
s
in
k
/s
ou
rc
e
p
e
r I
/O,
1
0
0
k
H
z
,
4
0
0
k
H
z
an
d
3-
4
M
H
z
I
2
C
™
su
pp
or
te
d
,
In
te
rru
p
t o
u
tp
u
t
2
8
-P
in
PD
IP
, 2
8
-Pi
n
SOIC,
2
8
-Pi
n
SSOP
,
2
8
-P
in
QF
N
M
C
P
23S
1
7
1
6
-b
it
I
/O
ex
p
a
nd
er
1.
8 t
o
5
.5
-4
0
to
+1
2
5
SPI
10
,0
00
3
H
W
ad
dr
es
s
pi
ns
,
25
m
Z
s
ink
/s
ou
rc
e
p
e
r I
/O,
In
te
rru
p
t o
u
tp
u
t
2
8
-P
in
PD
IP
, 2
8
-Pi
n
SOIC,
2
8
-Pi
n
SSOP
,
2
8
-P
in
QF
N
IN
TER
F
A
C
E
– Pa
ssiv
e
A
c
ces
s Pr
od
uct
s
Pa
rt
#
Op
e
ra
tin
g
V
o
lt
ag
e (
V
)
Op
e
ra
tin
g
Te
m
p
. R
a
n
g
e
(°
C)
Bu
s
T
y
pe
RF
Ca
rr
ie
r
F
req
ue
nc
y
D
a
ta
F
o
rm
a
t
F
e
a
tu
re
s
P
ac
kag
es
MCP2
0
3
0
1
.8
to
3
.6
-4
0
t
o
+8
5
SPI
1
2
5
k
H
z
NRZ
T
h
re
e ax
is
s
ig
n
a
l co
nd
it
io
ni
ng
dev
ic
es f
o
r pass
ive
acc
e
ss
a
p
p
lic
a
ti
o
ns,
hi
gh
-s
e
n
s
it
iv
it
y,
c
o
n
fi
g
u
rab
le
s
m
ar
t w
a
ke
-u
p f
ilt
er
1
4
-Pi
n
P
D
IP
, 1
4
-P
in
SOIC,
1
4
-P
in
T
S
S
O
P