Microchip Technology AC244045 Data Sheet
2010-2012 Microchip Technology Inc.
DS41440C-page 359
PIC16(L)F1825/1829
30.6
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C
Operating temperature -40°C
T
A
+125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA
Thermal Resistance Junction to Ambient
70.0
C/W
14-pin PDIP package
95.3
C/W
14-pin SOIC package
100
C/W
14-pin TSSOP package
45.7
C/W
16-pin QFN (4x4) package
62.2
C/W
20-pin PDIP package
77.7
C/W
20-pin SOIC package
87.3
C/W
20-pin SSOP package
43.0
C/W
20-pin QFN (4x4) package
TH02
JC
Thermal Resistance Junction to Case
32.8
C/W
14-pin PDIP package
31.0
C/W
14-pin SOIC package
24.4
C/W
14-pin TSSOP package
6.3
C/W
16-pin QFN (4x4) package
27.5
C/W
20-pin PDIP package
23.1
C/W
20-pin SOIC package
31.1
C/W
20-pin SSOP package
5.3
C/W
20-pin QFN (4x4) package
TH03
T
JMAX
Maximum Junction Temperature
150
C
TH04
PD
Power Dissipation
—
W
PD = P
INTERNAL
+ P
I
/
O
TH05
P
INTERNAL
Internal Power Dissipation
—
W
P
INTERNAL
= I
DD
x V
DD(1)
TH06
P
I
/
O
I/O Power Dissipation
—
W
P
I
/
O
=
(I
OL
* V
OL
) +
(I
OH
* (V
DD
- V
OH
))
TH07
P
DER
Derated Power
—
W
P
DER
= PD
MAX
(T
J
- T
A
)/
JA(2,3)
Note 1: I
DD
is current to run the chip alone without driving any load on the output pins.
2: T
A
= Ambient Temperature
3: T
J
= Junction Temperature