Intel 2.80 GHz BX80546KG2800EA Data Sheet
Product codes
BX80546KG2800EA
Intel® Xeon™ Processor with 800 MHz System Bus
Datasheet
79
8.0
Boxed Processor Specifications
8.1
Introduction
Intel boxed processors are intended for system integrators who build systems from components
available through distribution channels. The Intel® Xeon™ processor with 800 MHz system bus
will be offered as an Intel boxed processor.
available through distribution channels. The Intel® Xeon™ processor with 800 MHz system bus
will be offered as an Intel boxed processor.
Intel will offer boxed the Intel® Xeon™ processor with 800 MHz system bus with three product
configurations available for each processor frequency: 1U passive, 2U passive and 2U+ Active.
Although the active heatsink mechanically fits into a 2U keepout, additional design considerations
may need to be addressed to provide sufficient airflow to the fan inlet.
configurations available for each processor frequency: 1U passive, 2U passive and 2U+ Active.
Although the active heatsink mechanically fits into a 2U keepout, additional design considerations
may need to be addressed to provide sufficient airflow to the fan inlet.
The active heatsink is primarily designed to be used in a pedestal chassis where sufficient air inlet
space is present and side directional airflow is not an issue. The 1U and 2U passive heatsinks
require the use of chassis ducting and are targeted for use in rack mount servers. The retention
solution used for these products is called the Common Enabling Kit, or CEK. The CEK base is
compatible with all three heatsink solutions.
space is present and side directional airflow is not an issue. The 1U and 2U passive heatsinks
require the use of chassis ducting and are targeted for use in rack mount servers. The retention
solution used for these products is called the Common Enabling Kit, or CEK. The CEK base is
compatible with all three heatsink solutions.
The active heatsink solution for the boxed Intel® Xeon™ processor with 800 MHz system bus will
be transitioning after initial product introduction from a 3-pin thermistor controlled solution to a 4-
pin pulse width modulated (PWM)T-diode controlled solution. This transition is being done to help
customers meet acoustic targets in pedestal platforms, through the ability to directly control the
active heatsink fan RPM. To properly support this new active heatsink solution it may be necessary
to modify existing baseboard designs with 4-pin CPU fan headers. If a 4-pin active fan heatsink
solution is plugged into the older 3-pin fan header the heatsink will revert back to a thermistor
controlled mode. Please see the
be transitioning after initial product introduction from a 3-pin thermistor controlled solution to a 4-
pin pulse width modulated (PWM)T-diode controlled solution. This transition is being done to help
customers meet acoustic targets in pedestal platforms, through the ability to directly control the
active heatsink fan RPM. To properly support this new active heatsink solution it may be necessary
to modify existing baseboard designs with 4-pin CPU fan headers. If a 4-pin active fan heatsink
solution is plugged into the older 3-pin fan header the heatsink will revert back to a thermistor
controlled mode. Please see the
for more details.
through
as part of a boxed Intel® Xeon™ processor with 800 MHz system bus.
shows an
exploded view of the boxed processor thermal solution for the Intel® Xeon™ processor with
800 MHz system bus and the other CEK retention components.
800 MHz system bus and the other CEK retention components.
Figure 16.
1U Passive CEK Heatsink