STMicroelectronics FlexSPIN: SPI configurable stepper and DC multi motor driver evaluation board EVAL6460 EVAL6460 Data Sheet
Product codes
EVAL6460
L6460
Package mechanical data
Doc ID 17713 Rev 1
137/139
26
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at:
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK is an ST trademark.
Figure 51.
TQFP64 mechanical data an package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.20
0.0472
A1
0.05
0.15
0.002
0.006
A2
0.95
1.00
1.05
0.0374 0.0393 0.0413
b
0.17
0.22
0.27
0.0066 0.0086 0.0086
c
0.09
0.20
0.0035
0.0078
D
11.80
12.00
12.20
0.464
0.472
0.480
D1
9.80
10.00
10.20
0.386
0.394
0.401
D2
2.00
0.787
D3
7.50
0.295
E
11.80
12.00
12.20
0.464
0.472
0.480
E1
9.80
10.00
10.20
0.386
0.394
0.401
E2
2.00
0.787
E3
7.50
0.295
e
0.50
0.0197
L
0.45
0.60
0.75
0.0177 0.0236 0.0295
L1
1.00
0.0393
k
0˚
3.5˚
7˚
0˚
3.5˚
7˚
ccc
0.080
0.0031
TQFP64 (10x10x1.0mm)
Exposed Pad Down
7278840 B