Bourns PTC fuse Current I(H) 0.13 A 250 V (L x W x H) 10.2 x 8.9 x 7.2 mm MF-SD013/250-2 1 pc(s) MF-SD013/250-2 Data Sheet
Product codes
MF-SD013/250-2
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
MF-SD/250 Series - Telecom PTC Resettable Fuses
Product Dimensions
Recommended Pad Layout
DIMENSIONS:
MM
(INCHES)
Typical Part Marking
Solder Refl ow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (
°
C)
120
Preheating
Soldering
Cooling
Time (seconds)
Solder refl ow:
• Recommended refl ow methods: IR,
vapor phase oven, hot air oven.
• Devices are not designed to be
wave soldered to the bottom side
of the board.
• Gluing the devices is not
recommended.
• Recommended maximum paste
thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using
standard industry methods and
solvents.
• Recommended refl ow methods: IR,
vapor phase oven, hot air oven.
• Devices are not designed to be
wave soldered to the bottom side
of the board.
• Gluing the devices is not
recommended.
• Recommended maximum paste
thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using
standard industry methods and
solvents.
Packaging: TAPE & REEL = 400 pcs. per reel
How to Order
MF - SD 013/250 - 2
Multifuse
®
Product
Designator
Series
SD = Surface Mount
Dual Package
Hold Current, Ihold
013
013
(0.13
Amps)
Max. Interrupt Voltage, V
250 = 250 Volts
Packaging
- 2 = Tape and Reel*
*Packaged per EIA481-2
8.90
(.350)
MAX.
MAX.
MAX.
7.2
(.283)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
7.2
(.283)
MAX.
8.90
(.350)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
1
2
3
4
S D 0 1 3
MANUFACTURER'S
TRADEMARK
TRADEMARK
PART
IDENTIFICATION
IDENTIFICATION
0.01
0.1
1
10
100
1000
0
0.5
1
1.5
2
2.5
3
Fault Current (Amps)
Time to Trip (Seconds)
Note:
• If refl ow temperatures exceed the recommended profi le, devices may not meet the performance
requirements.
Rework:
• A device should not be reworked.
• If refl ow temperatures exceed the recommended profi le, devices may not meet the performance
requirements.
Rework:
• A device should not be reworked.
Typical Time to Trip at 23 ˚C
1
2
3
4
Schematic