Bourns PTC fuse Current I(H) 0.13 A 250 V (L x W x H) 10.2 x 8.9 x 7.2 mm MF-SD013/250-2 1 pc(s) MF-SD013/250-2 数据表

产品代码
MF-SD013/250-2
下载
页码 3
 Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
 
MF-SD/250 Series - Telecom PTC Resettable Fuses
Product Dimensions
Recommended Pad Layout
DIMENSIONS:
 MM
 (INCHES)
Typical Part Marking
Solder Refl ow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (
°
C)
120
Preheating
Soldering
Cooling
Time (seconds)
Solder refl ow:
•  Recommended refl ow methods: IR, 
  vapor phase oven, hot air oven.
•  Devices are not designed to be 
  wave soldered to the bottom side 
  of the board.
•  Gluing the devices is not 
 recommended.
• Recommended maximum paste 
  thickness is 0.25  mm (.010 inch).
•  Devices can be cleaned using 
  standard industry methods and 
 solvents.
Packaging:  TAPE & REEL = 400 pcs. per reel
How to Order
 
MF - SD 013/250 -  2
Multifuse
®
 Product 
Designator
Series
 
SD = Surface Mount 
 
        Dual Package
Hold Current, Ihold
 013 
(0.13 
Amps)
Max. Interrupt Voltage, V
 
250 = 250 Volts
Packaging
 
- 2 =  Tape and Reel*
*Packaged per EIA481-2 
8.90
(.350)
MAX.
MAX.
MAX.
7.2
(.283)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
7.2
(.283)
MAX.
8.90
(.350)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
1
2
3
4
S D 0 1 3
MANUFACTURER'S
TRADEMARK
PART
IDENTIFICATION
0.01
0.1
1
10
100
1000
0
0.5
1
1.5
2
2.5
3
Fault Current  (Amps)
Time to Trip (Seconds)
Note:  
•  If refl ow temperatures exceed the recommended profi le, devices may not meet the performance 
 requirements.
Rework:
•  A device should not be reworked.
Typical Time to Trip at 23 ˚C
1
2
3
4
Schematic