Intel 1.00 GHz BX80530F1000256 Data Sheet

Product codes
BX80530F1000256
Page of 128
112
 
Datasheet
Intel
®
 Celeron
®
 Processor up to 1.10 GHz
6.1.1.1
Boxed Processor Heatsink Weight 
The heatsink for the boxed Intel Celeron processor in the S.E.P. Package will not weigh more than 
225 grams. 
6.1.1.2
Boxed Processor Retention Mechanism
The boxed Intel Celeron processor requires a S.E.P. Package retention mechanism to secure the 
processor in the 242-contact slot connector. A S.E.P. Package retention mechanism are provided 
with the boxed processor. Motherboards designed for use by system integrators should include a 
retention mechanism and appropriate installation instructions. 
The boxed Intel Celeron processor does not require additional fan heatsink supports. Fan heatsink 
supports are not shipped with the boxed Intel Celeron processor.
Motherboards designed for flexible use by system integrators must still recognize the boxed 
Pentium II processor’s fan heatsink clearance requirements, which are described in the Pentium
®
 II 
Processor at 233, 266, 300, and 333 MHz Datasheet (Order Number 243335).
Figure 33. Front View Space Requirements for the Boxed Processor in the S.E.P. Package
Table 57.  Boxed Processor Fan Heatsink Spatial Dimensions for the S.E.P. Package
Fig. Ref. 
Label
Dimensions (Inches)
Min
Typ
Max
A
Fan Heatsink Depth (see 
)
1.40
B
Fan Heatsink Height from Motherboard (see 
)
0.58
C
Fan Heatsink Height (see 
)
2.00
D
Fan Heatsink Width (see 
4.80
E
Fan Heatsink Base Width (see 
5.4
F
Airflow Keepout Zones from end of Fan Heatsink
0.4
G
Airflow Keepout Zones from face of Fan Heatsink
0.2
4.74 (D)
2.02 (C)
5.40 (E)