Intel 1.00 GHz BX80530F1000256 Data Sheet

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The heatsink for the boxed Intel Celeron processor in the PPGA package will not weigh more than 
180 grams.

This section documents the mechanical specifications of the fan heatsink for the boxed Intel 
Celeron processor in the FC-PGA/FC-PGA2 (Flip-Chip Pin Grid Array) packages. The boxed 
processor in the FC-PGA/FC-PGA2 packages ships with a fan heatsink which has an integrated 
clip. 

 shows a mechanical representation of the boxed Intel Celeron processor in the 

FC-PGA/FC-PGA2 packages. 

 and 

 show the REQUIRED keepout dimensions for the boxed processor 

thermal solution. The cooling fin orientation on the heatsink relative to the PGA-370 socket is 
subject to change. Contact your local Intel sales representative for documentation specific to the 
boxed fan heatsink orientation relative to the PGA-370 socket.

The boxed processor fan heatsink is also asymmetrical in that the mechanical step feature 
(specified in 

) must sit over the socket’s cam. The step allows the heatsink to securely 

interface with the processor in order to meet the processors thermal requirements. 

0.043

0.472

U nits = inches