Intel 1.00 GHz BX80530F1000256 Data Sheet

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The heatsink for the boxed Intel Celeron processor in the FC-PGA/FC-PGA2 packages will not 
weigh more than 180 grams. 

This section describes the cooling requirements of the fan heatsink solution utilized by the boxed 
processors.

The boxed processor is directly cooled with a fan heatsink. However, meeting the processor's 
temperature specification is also a function of the thermal design of the entire system, and 
ultimately the responsibility of the system integrator. The processor temperature specification is 
found in 

 of this document. The boxed processor fan heatsink is able to keep the 

processor temperature within the specifications (see 

) in chassis that provide good 

thermal management. 

For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to 
the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of 
the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan 
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and 
decreases fan life. 

 illustrate an acceptable airspace clearance for the fan 

heatsink. It is also recommended that the air temperature entering the fan be kept below 45 °C. 
Again, meeting the processor's temperature specification is the responsibility of the system 
integrator. The processor temperature specification is found in 

 of this document.

0.40 Min Air Space (F)

(both ends)

0.20 Min

Air Space

(G)

Measure ambient temperature
0.3" above center of fan inlet

Fan Heatsink

Processor

Airspace