Intel 1.00 GHz BX80530F1000256 Data Sheet

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There are three package technologies which Celeron processors use. They are the S.E.P. Package, 
the PPGA package, and the FC-PGA/FC-PGA2 packages. The S.E.P. Package and FC-PGA/
FC-PGA2 packages contain the processor core and passive components, while the PPGA package 
does not have passive components.

The processor edge connector defined in this document is referred to as the “SC242 connector.” 
See the SC242 Design Guidelines (Order Number 243397) for further details on the edge 
connector.

The processor socket connector is defined in this document is referred to as the “370-pin socket.” 
See the 370-Pin Socket (PGA370) Design Guidelines (Order Number 244410) for further details on 
the socket.

This section defines the mechanical specifications and signal definitions for the Celeron processor 
in the S.E.P. Package.

The Celeron processor requires a retention mechanism. This retention mechanism may require 
motherboard holes to be 0.159" diameter if low cost plastic fasteners are used to secure the 
retention mechanisms. The larger diameter holes are necessary to provide a robust structural design 
that can shock and vibe testing. If captive nuts are used in place of the plastic fasteners, then either 
the 0.159" or the 0.140" diameter holes will suffice as long as the attach mount is used. 

 with substrate dimensions is provided to aid in the design of a heatsink and clip. In 

 all area on the secondary side of the substrate is zoned “keepout”, except for 25 mils 

around the tooling holes and the top and side edges of the substrate.