Intel III Xeon 900 MHz 80526KY9002M Data Sheet
Product codes
80526KY9002M
PENTIUM® III XEON™ PROCESSOR AT 600 MHz to 1 GHz with 256KB L2 Cache
BOXED PROCESSOR SPECIFICATIONS
84
E
F
Figure 35. Front View Space Requirements for the Boxed Processor
9.2.1 BOXED PROCESSOR HEATSINK DIMENSIONS
Table 47. Boxed Processor Heat sink Dimensions
Fig. Ref.
Label
Label
Dimensions (Inches)
Min
Typ
Max
A
Heat sink Depth (off heat sink attach point)
1.03
B
Heat sink Height (above baseboard)
0.485
C
Heat sink Base Thickness
0.200
D
Heat sink Total Height at Fins
4.065
E
Heat sink Total Height at Base (see front view)
4.235
F
Heat sink Width (see front view)
5.05
9.2.2 BOXED PROCESSOR HEATSINK WEIGHT
The boxed processor heat sink will not weigh more than 350 grams (without auxiliary fan).
9.2.3 BOXED PROCESSOR RETENTION MECHANISM
The boxed Pentium® III Xeon™ processor at 600 MHz+ requires a retention mechanism that supports and
secures the Single Edge Contact Cartridge (S.E.C.C.) in the 330-contact slot connector. An S.E.C.C.
retention mechanism is not provided with the boxed processor. Baseboards designed for use by system
integrators should include a retention mechanism and appropriate installation instructions. The boxed
Pentium® III Xeon™ processor at 600 MHz+ does not require additional heat sink supports. Heat sink
supports are not shipped with the boxed Pentium III Xeon processor at 600 MHz+.
secures the Single Edge Contact Cartridge (S.E.C.C.) in the 330-contact slot connector. An S.E.C.C.
retention mechanism is not provided with the boxed processor. Baseboards designed for use by system
integrators should include a retention mechanism and appropriate installation instructions. The boxed
Pentium® III Xeon™ processor at 600 MHz+ does not require additional heat sink supports. Heat sink
supports are not shipped with the boxed Pentium III Xeon processor at 600 MHz+.