Intel 4 620 JM80547PG0722MM Data Sheet

Product codes
JM80547PG0722MM
Page of 105
Datasheet
103
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed 
processor.
8.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's 
temperature specification is also a function of the thermal design of the entire system, and 
ultimately the responsibility of the system integrator. The processor temperature specification is 
found in 
The boxed processor TMA is able to keep the processor temperature within the 
specifications listed in 
 for chassis that provide good thermal management. For the boxed 
processor TMA to operate properly, it is critical that the airflow provided to the TMA is 
unimpeded. Airflow of the TMA is into the duct and out of the rear of the duct in a linear flow. 
Blocking the airflow to the TMA inlet reduces the cooling efficiency and decreases fan life. The air 
temperature entering the fan should be kept below 35 °C. Meeting the processor's temperature 
specification is the responsibility of the system integrator. 
Figure 8-5. Balanced Technology Extended (BTX) Mainboard Power Header Placement 
(hatched area)