Intel 4 620 JM80547PG0722MM Data Sheet

Product codes
JM80547PG0722MM
Page of 105
Datasheet
101
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8.1.3
Boxed Processor Support and Retention Module (SRM)
The boxed processor TMA requires a SRM assembly to attach directly to the chassis base pan and 
to secure the processor and TMA in the mainboard socket. The boxed processor TMA will ship 
with the heatsink attach clip assembly, duct, and screws for attachment. The SRM must be supplied 
by the chassis hardware vendor. See the Support and Retention Module (SRM) External Design 
Requirements Document
Balanced Technology Extended (BTX) System Design Guide, and the 
Intel
®
 Pentium
®
 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design 
Guidelines for more detailed design information regarding the support and retention module. 
8.2
Electrical Requirements
8.2.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be 
shipped with the boxed processor to draw power from a power header on the baseboard. The power 
cable connector and pinout are shown in 
. Baseboards must provide a matched power 
header to support the boxed processor. 
 contains specifications for the input and output 
signals at the fan heatsink connector. 
The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at a rate of 
2 pulses per fan revolution. A baseboard pull-up resistor provides V
OH
 to match the system board-
mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the 
SENSE signal is not used, pin 3 of the connector should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4
th
 pin of the connector 
labeled as CONTROL. This signal must be an open-drain output to be compatible with the 4-wire 
PWM fan specification. 
Figure 8-3. Assembly Stack Including the Support and Retention Module
Thermal Module Assembly
 - Heatsink and Fan
 - Clip
 - Structural Duct
Motherboard
SRM
Chassis Pan