Intel 4 620 JM80547PG0722MM Data Sheet

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The Pentium 4 processor in the 775-land package will also be offered as an boxed Intel processor. 
Boxed Intel processors are intended for system integrators who build systems from largely standard 
components. The boxed Pentium 4 processor in the 775-land package will be supplied with a 
cooling solution known as the Thermal Module Assembly (TMA). 

representation of a boxed Pentium 4 processor in the 775-land package. This chapter documents 
mainboard and system requirements for the TMA that will be supplied with the boxed Pentium 4 
processor in the 775-land package. This chapter is particularly important for OEMs that 
manufacture mainboards for system integrators. 

Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in 
brackets]. 

Drawings in this section reflect only the specifications on the boxed Intel processor product. These 
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system 
designer’s responsibility to consider their proprietary cooling solution when designing to the 
required keep-out zone on their system platforms and chassis. Refer to the Intel

Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guidelines for further 
guidance. 

NOTE: The duct, clip, heatsink, and fan can differ from this drawing representation; however, the basic shape 

and size will remain the same.