Intel ULV 353 LE80536VC900512 Data Sheet
Product codes
LE80536VC900512
Mobile Intel
®
Celeron
®
Processor (0.18µ) in BGA2 and Micro-PGA2 Packages
Datasheet
283654-003
46
5. Mechanical
Specifications
5.1
Surface-mount BGA2 Package Dimensions
The mobile Intel Celeron processor is packaged in a PBGA-B495 package (also known as BGA2)
with the back of the processor die exposed on top. Unlike previous mobile processors with
exposed die, the back of the mobile Intel Celeron processor die may be polished and very smooth.
The mechanical specifications for the surface-mount package are provided in Table 27. Figure 19
shows the top and side views of the surface-mount package, and Figure 20 shows the bottom view
of the surface-mount package. The substrate may only be contacted within the shaded region
between the keep-out outline and the edge of the substrate. The mobile Intel Celeron processor
will have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Please note that in order to implement VID on the BGA2 package,
some VID[4:0] balls may be depopulated.
with the back of the processor die exposed on top. Unlike previous mobile processors with
exposed die, the back of the mobile Intel Celeron processor die may be polished and very smooth.
The mechanical specifications for the surface-mount package are provided in Table 27. Figure 19
shows the top and side views of the surface-mount package, and Figure 20 shows the bottom view
of the surface-mount package. The substrate may only be contacted within the shaded region
between the keep-out outline and the edge of the substrate. The mobile Intel Celeron processor
will have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Please note that in order to implement VID on the BGA2 package,
some VID[4:0] balls may be depopulated.
Table 27. Surface-mount BGA2 Package Specifications
Symbol Parameter
Min
Max
Unit
A
Overall Height, as delivered
2.29
2.79
mm
A
1
Substrate Height, as delivered
1.50 REF
mm
A
2
Die
Height
0.854
REF
mm
b
Ball Diameter
0.78 REF
mm
D Package
Width
27.05
27.35 mm
D
1
Die
Width
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
mm
E Package
Length
30.85
31.15 mm
e Ball
Pitch
1.27
mm
E
1
Die
Length
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
mm
N Ball
Count
495
each
S
1
Outer Ball Center to Short Edge of Substrate
0.895 REF
mm
S
2
Outer Ball Center to Long Edge of Substrate
0.900 REF
mm
P
DIE
Allowable Pressure on the Die for Thermal Solution
—
689
kPa
W
Package Weight
4.5 REF
grams