Intel ULV 353 LE80536VC900512 Data Sheet

 Datasheet 

 

283654-003 

48 

 

All dimensions are in millimeters. Dimensions in figure are for reference only. See Table 27 for 
specifications. 

The mobile Intel Celeron processor is also packaged in a PPGA-B495 package (also known as 
Micro-PGA2) with the back of the processor die exposed on top. Unlike previous mobile 
processors with exposed die, the back of the mobile Intel Celeron processor die may be polished 
and very smooth. The mechanical specifications for the socketable package are provided in Table 
28. Figure 21 shows the top and side views of the socketable package, and Figure 22 shows the 
bottom view of the socketable package. The substrate may only be contacted within the region 
between the keep-out outline and the edge of the substrate. The mobile Intel Celeron processor 
will have one or two label marks. These label marks will be located along the long edge of the 
substrate outside of the keep-out region, and they will not encroach upon the 7-mm by 7-mm 
squares at the substrate corners. Unlike the BGA2 package, VID implementation does not require 
VID pins to be depopulated on the Micro-PGA2 package.