Intel 4 HT 631 80552PG0802M2M Data Sheet

10

Datasheet

The processor includes an address bus powerdown capability that removes power from 

the address and data signals when the FSB is not in use. This feature is always enabled 

on the processor.

Enhanced Intel

®

 SpeedStep

®

 technology allows trade-offs to be made between 

performance and power consumptions. This may lower average power consumption (in 

conjunction with OS support).

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in 

the active state when driven to a low level. For example, when RESET# is low, a reset 

has been requested. Conversely, when NMI is high, a nonmaskable interrupt has 

occurred. In the case of signals where the name does not imply an active state but 

describes part of a binary sequence (such as address or data), the ‘#’ symbol implies 

that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and 

D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

Front Side Bus refers to the interface between the processor and system core logic 

(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, 

memory, and I/O.

Commonly used terms are explained here for clarification:

• Intel

 4 processor on 65 nm process in the 775-land package — 

Processor in the FC-LGA6 package with a 2 MB L2 cache.

• Processor — For this document, the term processor is the generic form of the 

Intel

®

 Pentium

®

 4 processor 6x1 sequence on 65 nm process in the 775-land 

package.

• Keep-out zone — The area on or near the processor that system design can not 

utilize. 

• Intel

 945G/945GZ/945P/945PL Express chipsets — Chipset that supports 

DDR and DDR2 memory technology for the Pentium 4 processor.

• Processor core — Processor core die with integrated L2 cache. 
• LGA775 socket — The Pentium 4 processor mates with the system board through 

a surface mount, 775-land, LGA socket.

• Integrated heat spreader (IHS) —A component of the processor package used 

to enhance the thermal performance of the package. Component thermal solutions 

interface with the processor at the IHS surface.

• Retention mechanism (RM) — Since the LGA775 socket does not include any 

mechanical features for heatsink attach, a retention mechanism is required. 

Component thermal solutions should attach to the processor via a retention 

mechanism that is independent of the socket.

• FSB (Front Side Bus) — The electrical interface that connects the processor to 

the chipset. Also referred to as the processor system bus or the system bus. All 

memory and I/O transactions as well as interrupt messages pass between the 

processor and chipset over the FSB.

• Storage conditions — Refers to a non-operational state. The processor may be 

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 

exposed to free air. Under these conditions, processor lands should not be 

connected to any supply voltages, have any I/Os biased, or receive any clocks. 

Upon exposure to “free air”(i.e., unsealed packaging or a device removed from