Intel 4 HT 631 80552PG0802M2M Data Sheet
Product codes
80552PG0802M2M
Datasheet
5
Figures
and for 775_VR_CONFIG_06 Processors...................................................................... 21
10 land-out Diagram (Top View – Left Side) ..................................................................... 42
11 land-out Diagram (Top View – Right Side) ................................................................... 43
12 Thermal Profile for 775_VR_CONFIG_05A Processors .................................................... 77
13 Thermal Profile for 775_VR_CONFIG_06 Processors ...................................................... 78
14 Case Temperature (TC) Measurement Location ............................................................ 79
15 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 81
16 Processor Low Power State Machine ........................................................................... 86
17 Mechanical Representation of the Boxed Processor ....................................................... 89
18 Space Requirements for the Boxed Processor (Side View; applies to all four side views) .... 90
19 Space Requirements for the Boxed Processor (Top View)............................................... 90
20 Space Requirements for the Boxed Processor (Overall View) .......................................... 91
21 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 92
22 Baseboard Power Header Placement Relative to Processor Socket ................................... 93
23 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
11 land-out Diagram (Top View – Right Side) ................................................................... 43
12 Thermal Profile for 775_VR_CONFIG_05A Processors .................................................... 77
13 Thermal Profile for 775_VR_CONFIG_06 Processors ...................................................... 78
14 Case Temperature (TC) Measurement Location ............................................................ 79
15 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 81
16 Processor Low Power State Machine ........................................................................... 86
17 Mechanical Representation of the Boxed Processor ....................................................... 89
18 Space Requirements for the Boxed Processor (Side View; applies to all four side views) .... 90
19 Space Requirements for the Boxed Processor (Top View)............................................... 90
20 Space Requirements for the Boxed Processor (Overall View) .......................................... 91
21 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 92
22 Baseboard Power Header Placement Relative to Processor Socket ................................... 93
23 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 1 View) .......................................................................................................... 94
(Side 2 View) .......................................................................................................... 94
25 Mechanical Representation of the Boxed Processor with a Type I TMA ............................. 95
26 Mechanical Representation of the Boxed Processor with a Type II TMA ............................ 96
27 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes....... 97
28 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ....... 98
29 Assembly Stack Including the Support and Retention Module ......................................... 99
30 Boxed Processor TMA Power Cable Connector Description ............................................ 100
31 Balanced Technology Extended (BTX) Mainboard Power Header Placement
26 Mechanical Representation of the Boxed Processor with a Type II TMA ............................ 96
27 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes....... 97
28 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ....... 98
29 Assembly Stack Including the Support and Retention Module ......................................... 99
30 Boxed Processor TMA Power Cable Connector Description ............................................ 100
31 Balanced Technology Extended (BTX) Mainboard Power Header Placement