Intel 4 HT 631 80552PG0802M2M Data Sheet
Product codes
80552PG0802M2M
6
Datasheet
Tables
and for 775_VR_CONFIG_06 Processors ......................................................................20
10 GTL+ Signal Group DC Specifications ..........................................................................25
11 GTL+ Asynchronous Signal Group DC Specifications ......................................................25
12 PWRGOOD and TAP Signal Group DC Specifications.......................................................26
13 VTTPWRGD DC Specifications .....................................................................................27
14 BSEL[2:0] and VID[5:0] DC Specifications ...................................................................27
15 BOOTSELECT DC Specifications ..................................................................................27
16 GTL+ Bus Voltage Definitions .....................................................................................28
17 Core Frequency to FSB Multiplier Configuration.............................................................29
18 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................30
19 Front Side Bus Differential BCLK Specifications .............................................................32
20 Processor Loading Specifications.................................................................................37
21 Package Handling Guidelines......................................................................................37
22 Processor Materials...................................................................................................38
23 Alphabetical Land Assignments...................................................................................44
24 Numerical Land Assignment .......................................................................................54
25 Signal Description (Sheet 1 of 9) ................................................................................64
26 Processor Thermal Specifications for 775_VR_CONFIG_05A Processors ............................76
27 Processor Thermal Specifications for 775_VR_CONFIG_06 Processors ..............................76
28 Thermal Profile for 775_VR_CONFIG_05A Processors.....................................................77
29 Thermal Profile for 775_VR_CONFIG_06 Processors ......................................................78
30 Thermal “Diode” Parameters using Diode Model............................................................83
31 Thermal “Diode” Parameters using Transistor Model ......................................................83
32 Thermal “Diode” n
11 GTL+ Asynchronous Signal Group DC Specifications ......................................................25
12 PWRGOOD and TAP Signal Group DC Specifications.......................................................26
13 VTTPWRGD DC Specifications .....................................................................................27
14 BSEL[2:0] and VID[5:0] DC Specifications ...................................................................27
15 BOOTSELECT DC Specifications ..................................................................................27
16 GTL+ Bus Voltage Definitions .....................................................................................28
17 Core Frequency to FSB Multiplier Configuration.............................................................29
18 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................30
19 Front Side Bus Differential BCLK Specifications .............................................................32
20 Processor Loading Specifications.................................................................................37
21 Package Handling Guidelines......................................................................................37
22 Processor Materials...................................................................................................38
23 Alphabetical Land Assignments...................................................................................44
24 Numerical Land Assignment .......................................................................................54
25 Signal Description (Sheet 1 of 9) ................................................................................64
26 Processor Thermal Specifications for 775_VR_CONFIG_05A Processors ............................76
27 Processor Thermal Specifications for 775_VR_CONFIG_06 Processors ..............................76
28 Thermal Profile for 775_VR_CONFIG_05A Processors.....................................................77
29 Thermal Profile for 775_VR_CONFIG_06 Processors ......................................................78
30 Thermal “Diode” Parameters using Diode Model............................................................83
31 Thermal “Diode” Parameters using Transistor Model ......................................................83
32 Thermal “Diode” n
33 Thermal Diode Interface ............................................................................................84
34 Power-On Configuration Option Signals .......................................................................85
35 Fan Heatsink Power and Signal Specifications...............................................................92
36 TMA Power and Signal Specifications ......................................................................... 100
37 TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors ............ 103
34 Power-On Configuration Option Signals .......................................................................85
35 Fan Heatsink Power and Signal Specifications...............................................................92
36 TMA Power and Signal Specifications ......................................................................... 100
37 TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors ............ 103
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