Intel 4 HT 631 80552PG0802M2M Data Sheet

Datasheet

93

 

This section describes the cooling requirements of the fan heatsink solution used by the 

boxed processor.

The boxed processor may be directly cooled with a fan heatsink. However, meeting the 

processor's temperature specification is also a function of the thermal design of the 

entire system, and ultimately the responsibility of the system integrator. The processor 

temperature specification is in 

. The boxed processor fan heatsink is able to 

keep the processor temperature within the specifications in chassis that provide good 

thermal management. For the boxed processor fan heatsink to operate properly, it is 

critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan 

heatsink is into the center and out of the sides of the fan heatsink. Airspace is required 

around the fan to ensure that the airflow through the fan heatsink is not blocked. 

Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases 

 illustrate an acceptable airspace clearance for the fan 

heatsink. The air temperature entering the fan should be kept below 38 °C. A 

Thermally Advantaged Chassis with an Air Guide 1.1 is recommended to meet the 

38 °C requirement. Again, meeting the processor's temperature specification is the 

responsibility of the system integrator. 

The processor fan is the primary source of airflow for cooling the V

CC

 voltage regulator. 

Dedicated voltage regulator cooling components may be necessary if the selected fan is 

not capable of keeping regulator components below maximum rated temperatures.

B

C

R110

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