Intel i3-2328M FF8062701275100 Data Sheet
Product codes
FF8062701275100
Datasheet, Volume 1
61
Thermal Management
5
Thermal Management
The thermal solution provides both the component-level and the system-level thermal
management. To allow for the optimal operation and long-term reliability of Intel
processor-based systems, the system/processor thermal solution should be designed
so that the processor:
management. To allow for the optimal operation and long-term reliability of Intel
processor-based systems, the system/processor thermal solution should be designed
so that the processor:
• Remains below the maximum junction temperature (T
j,Max
) specification at the
maximum thermal design power (TDP).
• Conforms to system constraints, such as system acoustics, system skin-
temperatures, and exhaust-temperature requirements.
Caution:
Thermal specifications given in this chapter are on the component and package level
and apply specifically to the 2nd Generation Intel
®
Core™ processor family mobile and
Intel
®
Celeron
®
processor family mobile. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
5.1
Thermal Design Power (TDP) and Junction
Temperature (Tj)
The processor TDP is the maximum sustained power that should be used for design of
the processor thermal solution. TDP represents an expected maximum sustained power
from realistic applications. TDP may be exceeded for short periods of time or if running
a “power virus” workload. Due to Intel Turbo Boost Technology, applications are
expected to run closer to TDP more often as the processor attempts to take advantage
of available headroom in the platform to maximize performance.
the processor thermal solution. TDP represents an expected maximum sustained power
from realistic applications. TDP may be exceeded for short periods of time or if running
a “power virus” workload. Due to Intel Turbo Boost Technology, applications are
expected to run closer to TDP more often as the processor attempts to take advantage
of available headroom in the platform to maximize performance.
The processor may also exceed the TDP for short durations after a period of lower
power operation due to its turbo feature. This feature is intended to take advantage of
available thermal capacitance in the thermal solution for momentary high power
operation. The duration and time of such operation can be limited by platform runtime
configurable registers within the processor.
power operation due to its turbo feature. This feature is intended to take advantage of
available thermal capacitance in the thermal solution for momentary high power
operation. The duration and time of such operation can be limited by platform runtime
configurable registers within the processor.
The processor integrates multiple processor and graphics cores on a single die. This
may result in differences in the power distribution across the die and must be
considered when designing the thermal solution.
may result in differences in the power distribution across the die and must be
considered when designing the thermal solution.
5.2
Thermal Considerations
Intel Turbo Boost Technology allows processor cores and Processor Graphics cores to
run faster than the baseline frequency. During a turbo event, the processor can exceed
its TDP power for brief periods. Turbo is invoked opportunistically and automatically as
long as the processor is conforming to its temperature, power delivery, and current
specification limits. Thus, thermal solutions and platform cooling that are designed to
be less than thermal design guidance may experience thermal and performance issues
since more applications will tend to run at or near the maximum power limit for
significant periods of time.
run faster than the baseline frequency. During a turbo event, the processor can exceed
its TDP power for brief periods. Turbo is invoked opportunistically and automatically as
long as the processor is conforming to its temperature, power delivery, and current
specification limits. Thus, thermal solutions and platform cooling that are designed to
be less than thermal design guidance may experience thermal and performance issues
since more applications will tend to run at or near the maximum power limit for
significant periods of time.