Intel Core 2 Extreme QX9300 BX80562QX9300 User Manual

66

Datasheet

BPM_2[0]#

N5

BPM_2[3:0]# (Breakpoint Monitor) are breakpoint and performance 
monitor signals of the second die. They are outputs from the 
processor that indicate the status of breakpoints and programmable 
counters used for monitoring processor performance. BPM_2[3:0]# 
should connect the appropriate pins of all processor FSB agents.This 
includes debug or performance monitoring tools.

BPM_2[1]#

M4

BPM_2[2]#

B2

BPM_2[3]#

AE8

BR1#

AA7

Arbitration Request signal for the second die.
BR1# is connected to the first die within the package, allowing two 
dies within quad-core parts to artitrite for the bus. This pin is 
fundamentally provided for debug capabilities and should be left as a 
NC.

GTLREF_2

D22 GTL reference level for AGTL+ input pins of the second die. 

GTLREF_CONTROL

F8

This pin can be used as GTLREF_2 disconnect circuit control signal.
GTLREF_2 maps out to a reserved pin on Intel Core

 

2 Duo mobile 

processor, for dual-core and quad-core interchangeable 
motherboard,GTLREF_CONTROL can be used as a control signal for a 
circuit that will automaticlly switch between Dual Core and quad-
core modes.

RSVD

AC8

These pins are RESERVED and must be left unconnected on the 
board. However, it is recommended that routing channels to these 
pins on the board be kept open for possible future use.

RSVD

AA8

RSVD

D8

TDI_M

F6

TDI_M (Test Data In) transfers serial test data into the second die. 
TDI_M provides the serial input needed for JTAG specification 
support. Connect to TDO_M on the platform.

TDO_M

D3

TDO_M (Test Data Out) transfers serial test data out of the first die. 
TDO_M provides the serial output needed for JTAG specification 
support. Connect to TDI_M on the platform.

THRMDA_2

T2

Thermal Diode Anode of the second die.

THRMDC_2

V3

Thermal Diode Cathode of the second die.

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