Intel Core 2 Extreme QX9300 BX80562QX9300 User Manual
Product codes
BX80562QX9300
Datasheet
67
Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
The processor requires a thermal solution to maintain temperatures within operating
limits.
Caution:
Operating the processor outside these operating limits may result in permanent
damage to the processor and potentially other components in the system.
Maintaining the proper thermal environment is key to reliable, long-term system
operation. A complete thermal solution includes both component and system-level
thermal management features. To allow for the optimal operation and long-term
reliability of Intel processor-based systems, the system/processor thermal solution
should be designed so the processor remains within the minimum and maximum
junction temperature (T
J
) specifications at the corresponding thermal design power
(TDP) value listed in
. Analysis indicates that real applications are unlikely to
cause the processor to consume the theoretical maximum power dissipation for
sustained time periods.
NOTES:
1.
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
Refer to
for details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
within specifications.
Table 16.
Processor Power Specifications
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit
Notes
TDP
QX9300
Q9100
Q9000
Q9100
Q9000
2.53 GHz & V
CCHFM
2.26 GHz & V
CCHFM
2.0 GHz & V
CCHFM
1.60 GHz & V
CCLFM
45
45
45
35
45
45
35
W
1, 4,
5, 6
Symbol
Parameter
Min Typ
Max
Unit
Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at HFM V
at HFM V
CC
at LFM V
CC
—
—
19.4
14.5
14.5
W
2, 5, 7
P
SLP
Sleep Power
at HFM V
at HFM V
CC
at LFM V
CC
—
—
18.6
14.1
14.1
W
2, 5, 7
P
DSLP
Deep Sleep Power
at HFM V
at HFM V
CC
at LFM V
CC
—
—
7.9
7.1
7.1
W
2, 5, 8
P
DPRSLP
Deeper Sleep Power
—
—
4.0
W
2, 8
T
J
Junction Temperature
0
—
100
°C
3, 4