Intel Core 2 Extreme QX9300 BX80562QX9300 User Manual

Product codes
BX80562QX9300
Page of 72
Datasheet
69
Thermal Specifications and Design Considerations
NOTES:
1.
Intel does not support or recommend operation of the thermal diode under reverse bias. 
2.
Characterized across a temperature range of 50-100°C.
3.
Not 100% tested. Specified by design characterization.
4.
The ideality factor, nQ, represents the deviation from ideal transistor model behavior as 
exemplified by the equation for the collector current:
I
C
 = I
S
 * (e 
qV
BE
/n
Q
kT
 –1)
where I
S
 = saturation current, q = electronic charge, V
BE
 = voltage across the transistor 
base emitter junction (same nodes as VD), k = Boltzmann Constant, and T = absolute 
temperature (Kelvin).
5.1.2
Intel® Thermal Monitor
The Intel® Thermal Monitor helps control the processor temperature by activating the 
TCC (Thermal Control Circuit) when the processor silicon reaches its maximum 
operating temperature. The temperature at which the Intel Thermal Monitor activates 
the TCC is not user configurable. Bus traffic is snooped in the normal manner and 
interrupt requests are latched (and serviced during the time that the clocks are on) 
while the TCC is active.
With a properly designed and characterized thermal solution, it is anticipated that the 
TCC would only be activated for very short periods of time when running the most 
power-intensive applications. The processor performance impact due to these brief 
periods of TCC activation is expected to be minor and hence not detectable. An under-
designed thermal solution that is not able to prevent excessive activation of the TCC in 
the anticipated ambient environment may cause a noticeable performance loss and 
may affect the long-term reliability of the processor. In addition, a thermal solution that 
is significantly under designed may not be capable of cooling the processor even when 
the TCC is active continuously.
The Intel Thermal Monitor controls the processor temperature by modulating (starting 
and stopping) the processor core clocks or by initiating an Enhanced Intel SpeedStep 
Technology transition when the processor silicon reaches its maximum operating 
Table 17.
Thermal Diode Interface
Signal Name
Pin/Ball Number
Signal Description
THERMDA
A24
Thermal diode anode
THERMDC
B25
Thermal diode cathode
THERMDA_2
T2
Thermal diode anode of the second die
THERMDC_2
V3
Thermal diode cathode of the second die
Table 18.
Thermal Diode Parameters Using Transistor Model
Symbol
Parameter
Min
Typ
Max
Unit
Notes
I
FW
Forward Bias Current
5
200
μA
1
I
E
Emitter Current
5
200
μA
1
n
Q
Transistor Ideality
0.997
1.001
1.008
2, 3, 4
Beta
0.1
0.4
0.5
2, 3
R
T
Series Resistance
3.0
4.5
7.0
Ω
2