Intel C2350 FH8065401488914 Data Sheet
Product codes
FH8065401488914
Volume 3—Signal Names and Descriptions—C2000 Product Family
System DDR Memory Signals
Intel
®
Atom™ Processor C2000 Product Family for Microserver
Datasheet, Vol. 3 of 3
September 2014
576
Order Number: 330061-002US
DDR3_0_CKE[3:0]
O
DDR
4
VDDQ
DDR3 Clock Enable: (active
high). CKE is used for power
control of the DRAM devices.
For the DRAM Devices: CKE
HIGH activates, and CKE LOW
deactivates, internal clock
signals and device input
buffers and output drivers.
Taking CKE LOW provides Pre-
charge Power Down and Self-
Refresh operation (all banks
idle) or Active Power Down
(row Active in any bank). CKE
is synchronous for a power
down entry and exit, and for
self-refresh entry. CKE is
asynchronous for self-refresh
exit. After VREF has become
stable during the power-on
and initialization sequence, it
must be maintained for proper
operation of the CKE receiver.
For proper self-refresh entry
and exit, VREF must be
maintained to this input. CKE
must be maintained HIGH
throughout read and write
accesses. Input buffers,
excluding CK, CKB, ODT, and
CKE are disabled during
power down. Input buffers,
excluding CKE, are disabled
during self-refresh.
DDR3_0_CSB[3:0]
O
DDR
4
VDDQ
DDR3 Chip Select: (active
low). These signals determine
whether a command is valid in
a given cycle for the devices
connected to it. All commands
are masked when CSB is
registered HIGH. CSB
provides for external Rank
selection on systems with
multiple Ranks. CSB is
considered part of the
command code.
Table 31-4. DDR0 Signals (Sheet 3 of 5)
Signal Name
I/O
Type
I/O Buffer
Type
Ball
Count
Internal
Resistor
PU/PD
External
Resistor
PU/PD
Power
Rail
Description