Intel C2350 FH8065401488914 Data Sheet

Product codes
FH8065401488914
Page of 746
Volume 3—Signal Names and Descriptions—C2000 Product Family
System DDR Memory Signals
Intel
®
 Atom™ Processor C2000 Product Family for Microserver
Datasheet, Vol. 3 of 3
September 2014
576
Order Number: 330061-002US
DDR3_0_CKE[3:0]
O
DDR
4
VDDQ
DDR3 Clock Enable: (active 
high). CKE is used for power 
control of the DRAM devices. 
For the DRAM Devices: CKE 
HIGH activates, and CKE LOW 
deactivates, internal clock 
signals and device input 
buffers and output drivers. 
Taking CKE LOW provides Pre-
charge Power Down and Self-
Refresh operation (all banks 
idle) or Active Power Down 
(row Active in any bank). CKE 
is synchronous for a power 
down entry and exit, and for 
self-refresh entry. CKE is 
asynchronous for self-refresh 
exit. After VREF has become 
stable during the power-on 
and initialization sequence, it 
must be maintained for proper 
operation of the CKE receiver. 
For proper self-refresh entry 
and exit, VREF must be 
maintained to this input. CKE 
must be maintained HIGH 
throughout read and write 
accesses. Input buffers, 
excluding CK, CKB, ODT, and 
CKE are disabled during 
power down. Input buffers, 
excluding CKE, are disabled 
during self-refresh.
DDR3_0_CSB[3:0]
O
DDR
4
VDDQ
DDR3 Chip Select: (active 
low). These signals determine 
whether a command is valid in 
a given cycle for the devices 
connected to it. All commands 
are masked when CSB is 
registered HIGH. CSB 
provides for external Rank 
selection on systems with 
multiple Ranks. CSB is 
considered part of the 
command code.
Table 31-4. DDR0 Signals (Sheet 3 of 5)
Signal Name
I/O 
Type
I/O Buffer 
Type
Ball 
Count
Internal 
Resistor 
PU/PD
External 
Resistor 
PU/PD
Power 
Rail
Description