Intel Core 2 Duo E7300 BX80570E7300 User Manual

Thermal and Mechanical Design Guidelines   

 15 

The processors covered in the document are packaged in a 775-Land LGA package 

that interfaces with the motherboard  using a LGA775 socket. Refer to the datasheet 

for detailed mechanical specifications.  

The processor connects to the motherboard through a land grid array (LGA) surface 

mount socket. The socket contains 775 contacts arrayed about a cavity in the center 

of the socket with solder balls for surface mounting to the motherboard. The socket is 

named LGA775 socket. A description of the socket can be found in the LGA775 Socket 

Mechanical Design Guide.  

The package includes an integrated heat spreader (IHS) that is shown in Figure 

for illustration only. Refer to the processor datasheet for further information. In case 

of conflict, the package dimensions in the processor datasheet supersedes dimensions 

provided in this document.