Intel Core 2 Duo E7300 BX80570E7300 User Manual
Product codes
BX80570E7300
Introduction
Thermal and Mechanical Design Guidelines
13
1.2
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Location
Intel
®
Core™2 Duo Processor E8000 and E7000 Series
Datasheet
Intel
®
Pentium
®
Dual-Core Processor E6000 and E5000
Series Datasheet
Intel
®
Celeron
®
Processor E3x00 Series Datasheet
LGA775 Socket Mechanical Design Guide
uATX SFF Design Guidance
http://www.formfactors.org/
Fan Specification for 4-wire PWM Controlled Fans
http://www.formfactors.org/
ATX Thermal Design Suggestions
http://www.formfactors.org/
microATX Thermal Design Suggestions
http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design
Guide
Guide
http://www.formfactors.org/
Thermally Advantaged Chassis Design Guide
http://www.intel.com/go/chassis/
1.3
Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The
ambient temperature should be measured just upstream of a passive heatsink
or at the fan inlet for an active heatsink.
ambient temperature should be measured just upstream of a passive heatsink
or at the fan inlet for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of
the topside of the IHS.
the topside of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
usually measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a
location corresponding to
location corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
CA
Case-to-ambient thermal characterization parameter (psi). A measure of
thermal solution performance using total package power. This is defined as:
(T
thermal solution performance using total package power. This is defined as:
(T
C
– T
A
) / Total Package Power.
Note: Heat source must be specified for
measurements.
CS
Case-to-sink thermal characterization parameter. A measure of thermal
interface material performance using total package power. This is defined as:
(T
interface material performance using total package power. This is defined as:
(T
C
– T
S
) / Total Package Power.
Note: Heat source must be specified for
measurements.