Intel Core 2 Duo E7300 BX80570E7300 User Manual

Thermal and Mechanical Design Guidelines   

 41 

The reference thermal module assembly is a Type II BTX compliant design and is 

compliant with the reference BTX motherboard keep-out and height recommendations 
defined in Section 

6.6. 

The solution comes as an integrated assembly. An isometric view of the assembly is 
provided in Figure 

5-4.  

5–1 provides the target heatsink performance for the processor with the BTX 

boundary conditions. The results will be evaluated using the test procedure described 
in Section 

5.2. 

The table also includes a T

A

 assumption of 35.5° C for the Intel reference thermal 

solution at the processor fan heatsink inlet discussed in section 

3.3. The analysis 

assumes a uniform 35° C external ambient temperature to the chassis of across the 

fan inlet, resulting in a temperature rise, T

R

, of 0.5° C. Meeting T

A

 and 

CA

 targets can 

maximize processor performance (refer to Sections 

2.2, 

4). 

Minimizing T

R

, can lead to improved acoustics. 

 

ca 

(Mean + 3) 

Intel Core™2 Duo Processor E8000 
series with 6 MB cache  

0.57 C/W 35.5 

C 1,2,3 

Intel Core™2 Duo processor E7000 
series with 3 MB cache /Intel Pentium

®

 

dual-core processor E6000, E5000 series 
with 2 MB cache / Intel

®

 Celeron

®

   

processor E3x00 series with 1 MB cache

 

0.594 C/W 35.5 

C 1,2,3 

NOTES:  

1. 

Performance targets (Ψ ca) as measured with a live processor at TDP. 

2. 

The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with  

6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium

®

 

dual-core processor E6000, E5000 series with 2 MB cache, and Intel

®

 Celeron

®

 

processor E3x00 series is due to a slight difference in the die size. 

3. 

This data is pre-silicon data, and subject to change with the post silicon validate results