Intel Core 2 Duo E7300 BX80570E7300 User Manual

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Thermal and Mechanical Design Guidelines  

Structural design strategy for the Intel Type II TMA is to minimize upward board 

deflection during shock to help protect the LGA775 socket. 

BTX thermal solutions use the SRM and TMA that together resists local board 
curvature under the socket and minimize, board deflection (Figure 

5-5). In addition, a 

moderate preload provides initial downward deflection.  

 

 

The Thermal Module assembly is required to provide a static preload to ensure 

protection against fatigue failure of socket solder joint. The allowable preload range 
for BTX platforms is provided in Table 

5–4, but the specific target value is a function 

of the Thermal Module effective stiffness. 

The solution space for the Thermal Module effective stiffness and applied preload 
combinations is shown by the shaded region of Figure 

5-6. This solution space shows 

that the Thermal Module assembly must have an effective stiffness that is sufficiently 

large such that the minimum preload determined from the relationship requirement in 
Figure 

5-6 does not exceed the maximum allowed preload shown in Table 

5–4. 

Furthermore, if the Thermal Module effective stiffness is so large that the minimum 
preload determined from Figure 

5-6 is below the minimum required value given in