Intel Core 2 Duo E7300 BX80570E7300 User Manual

Thermal and Mechanical Design Guidelines   

 51 

5–4, then the Thermal Module should be re-designed to have a preload that lies 

within the range given in Table 

5–4, allowing for preload tolerances. 

 

Processor Preload 

98 N [22 lbf] 

222 N [50 lbf] 

1 

NOTES:  

1. 

These values represent upper and lower bounds for the processor preload. The nominal 

preload design point for the Thermal Module is based on a combination of requirements 

of the TIM, ease of assembly and the Thermal Module effective stiffness. 

 

 

NOTES:  

1. 

The shaded region shown is the acceptable domain for Thermal Module assembly 

effective stiffness and processor preload combinations. The Thermal Module design 

should have a design preload and stiffness that lies within this region. The design 

tolerance for the preload and TMA stiffness should also reside within this boundary. 

Note that the lower and upper horizontal boundaries represent the preload limits 
provided in Table 

5–4. The equation for the left hand boundary is described in note 2. 

2. 

The equation for this section of the preload-Thermal Module stiffness boundary is given 

by the following relationship: Min Preload = 1.38E-3*k^2 – 1.18486k + 320.24753 for 

k < 300 N/mm where k is the Thermal Module assembly effective stiffness. Note that 

this equation is only valid in the stiffness domain of 93N/mm < k < 282N/mm. This 

equation would not apply, for example, for TMA stiffness less than 93N/mm, 

3. 

The target stiffness for the 65W Type II TMA reference design is 484 N/mm  

(2764 lb / in).