Intel Core 2 Duo E7300 BX80570E7300 User Manual

Thermal and Mechanical Design Guidelines   

 53 

This chapter will document the requirements for an active air-cooled design, with a 

fan installed at the top of the heatsink. The thermal technology required for the 

processor.  

The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core 

processor E6000, E5000 series, and Intel

®

 Celeron

®

 processor E3x00 series require a 

thermal solution equivalent to the E18764-001 reference design; see Figure 6-1 for an 

exploded view of this reference design. 

Note:  The part number E18764-001 provided in this document is for reference only. The 

revision number -001 may be subject to change without notice. 

The E18764-001 reference design takes advantage of an acoustic improvement to 

reduce the fan speed to show the acoustic advantage (its acoustic results show in the 
Table 

6–2). 

The E18764-001 reference design takes advantage of the cost savings for the several 

features of the design including the reduced heatsink height, inserted aluminum core 

and the new TIM material (Dow Corning TC-1996 grease), see Figure 6-2. The overall 

46mm height thermal solution supports the unique and smaller desktop PCs including 

small and ultra small form factors, down to the 5L size, see uATX SFF Guidance for 

additional details on uATX SFF design.