HP Performance Optimized Data Center (POD) 240a User Manual
Power, electrical, and controls 26
Side view shown
Bonding
All structural sections of the HP POD 240e NA are bonded by connecting all metallic, non-current carrying
All structural sections of the HP POD 240e NA are bonded by connecting all metallic, non-current carrying
items throughout the HP POD 240e NA to protect from electric shock. If all steel-to-steel areas are bonded to
one another, each object then has the same electrical potential which ultimately dissipates any high voltage
or shock across the entire HP POD 240e NA, minimizing any effects from a lightning strike, per NFPA 70 in
accordance with NEC (NA) and IEC (EMEA and APJ).
accordance with NEC (NA) and IEC (EMEA and APJ).
Lightning protection
The HP POD 240e NA structure and internal components are all bonded together. A common grounding
electrode conductor connection point is provided. Proper bonding and grounding of the HP POD 240e NA
minimizes the effects of a lightning strike. A surge protection device is provided on the HP POD 240e NA
input connection to protect the HP POD 240e NA electrical system from voltage transients. If your site is in an
area that is subject to frequent lightning strikes, the HP POD 240e NA must be protected in accordance with
area that is subject to frequent lightning strikes, the HP POD 240e NA must be protected in accordance with
NFPA 70 (NA) and IEC (EMEA and APJ). HP recommends that you contact a certified lightning protection
consultant.
Capacities
Each HP POD 240e NA is unique and the specific power and cooling capacities vary for each POD that uses
Adiabatic cooling. For specific capacity information, see your HP Performance Optimized Datacenter 240e
NA Customized Supplement.