IBM Intel Xeon E5506 46M1079 User Manual

Intel

®

 Xeon

®

 Processor 5500 Series Datasheet, Volume 1

137

Intel boxed processors are intended for system integrators who build systems from 
components available through distribution channels. The Intel

®

 Xeon

®

 processor 5500 

series will be offered as an Intel boxed processor, however the thermal solution will be 
sold separately.

Unlike previous-generation boxed processors, Intel Xeon processor 5500 series boxed 
processors will not include thermal solution in the box. Intel will offer boxed thermal 
solutions separately through the same distribution channels. Please reference 

 - 

 for more details on Boxed Processor Thermal Solutions.

Intel will offer three different Boxed Heat Sink solutions to support the boxed 

Processors.

• Boxed Intel “Combo” Thermal Solution. The Passive / Active Combination Heat Sink 

Solution is intended for processors with a TDP up to 130W in a pedestal or 2U+ 
chassis with appropriate ducting)

• Boxed Intel “Active” Thermal Solution. The Active Heat Sink Solution is intended for 

processors with a TDP of 80W or lower in pedestal chassis

• Boxed Intel “Passive” Thermal Solution. The 25.5mm tall Passive Heat Sink 

Solution is intended for processors with a TDP of 95W or lower in Blades, 1U, or 2U 
chassis with appropriate ducting.

The Passive / Active combination solution, based on a 2U passive heat sink with a 
removable fan, is intended for use with processors with TDP’s up to 130 W. This heat 
pipe based solution is intended to be used as either a passive heat sink in a 2U or 
larger chassis, or as an active heat sink for pedestal chassis. 

are representations of the heat sink solution. Although the active combination solution 
with the removable fan installed mechanically fits into a 2U keepout, its use has not 
been validated in that configuration.

The Passive / Active combination solution in the active fan configuration is primarily 
designed to be used in a pedestal chassis where sufficient air inlet space is present. The 
Passive / Active combination solution with the fan removed, as with any passive 
thermal solution, will require the use of chassis ducting and are targeted for use in rack 
mount or ducted pedestal servers. The retention solution used for these products is 
called Unified Retention System (URS).