IBM Intel Xeon E5506 46M1079 User Manual

Product codes
46M1079
Page of 154
 Intel
®
 Xeon
®
 Processor 5500 Series Datasheet, Volume 1
9
Introduction
1
Introduction
The Intel
®
 Xeon
®
 Processor 5500 Series is the first-generation server/workstation 
multi-core processor to implement key new technologies:
• Integrated Memory Controller
• Point-to-point link interface based on Intel
®
 QuickPath Technology
The processor is optimized for performance with the power efficiencies of a low-power 
microarchitecture to enable smaller, quieter systems.
This document provides DC electrical specifications, differential signaling specifications, 
pinout and signal definitions, package mechanical specifications and thermal 
requirements, and additional features pertinent to implementation and operation of the 
processor. For information on register descriptions, refer to the Intel
®
 Xeon
®
 Processor 
5500 Series Datasheet, Volume 2
Intel Xeon Processor 5500 Series are multi-core processors, based on 45 nm process 
technology. The processor family features a range of thermal design power (TDP) 
envelopes from 38W TDP up to 130W TDP. These processors feature two Intel 
QuickPath Interconnect point-to-point links capable of up to 6.4 GT/s, up to 8 MB of 
shared cache, and an Integrated Memory Controller. The processors support all the 
existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) 
and Streaming SIMD Extensions 4 (SSE4). The processors support several Advanced 
Technologies: Execute Disable Bit, Intel
®
 64 Technology, Enhanced Intel SpeedStep
®
 
Technology, Intel
®
 Virtualization Technology (Intel
®
 VT), Intel
®
 Hyper-Threading 
Technology (Intel
®
 HT Technology), and Intel
®
 Turbo Boost Technology (Intel
®
 TBT).
The Intel Xeon Processor 5500 Series family supports multiple platform segments.
• 2-Socket Workstation Platforms support Intel
®
 Xeon
®
 Processor W5580, a 130W 
Thermal Design Power (TDP) SKU. These platforms provide optimal overall 
performance and reliability, in addition to high-end graphics support. Note, specific 
platform usage conditions apply when implementing these processors.
• 2-Socket High Performance Server and High Performance Computing (HPC) 
Platforms support Intel Xeon Processor 5500 Series Advanced SKU (95W TDP). 
These platforms provide optimal overall performance.
• 2-Socket Volume Server Platforms support Intel Xeon Processor 5500 Series 
Standard/Basic SKUs (80W TDP). These platforms provide optimal performance per 
watt for rack-optimized platforms.
• Ultra Dense Platforms implement Intel Xeon Processor 5500 Series Low Power SKU 
(60W TDP). These processors are intended for dual-processor server blades and 
embedded servers.
• Intel
®
 Xeon
®
 Processor L5518 with 60W TDP and elevated case temperatures. The 
elevated case temperatures are intended to meet the short-term thermal profile 
requirements of NEBS Level 3. These 2-Socket processors are ideal for thermally-
constrained form factors in embedded servers, comms and storage markets.
• Intel
®
 Xeon
®
 Processor L5508 with 38W TDP and elevated case temperatures. The 
elevated case temperatures are intended to meet the short-term thermal profile 
requirements of NEBS Level 3. These 2-Socket processors are ideal for thermally-
constrained form factors in embedded servers, comms and storage markets.