Intel C2D Mobile T5800 LF80537GG041F User Manual

Product codes
LF80537GG041F
Page of 113
Introduction
8
Datasheet
• Digital thermal sensor (DTS)
• Intel® 64 architecture 
• Supports enhanced Intel® Virtualization Technology
• Enhanced Intel® Dynamic Acceleration Technology and Enhanced Multi-Threaded 
Thermal Management (EMTTM)
• Supports PSI2 functionality
• SV processor offered in Micro-FCPGA and Micro-FCBGA packaging technologies
• Processor in POP, LV and ULV are offered in Micro-FCBGA packaging technologies 
only 
• Execute Disable Bit support for enhanced security
• Intel® Deep Power Down low-power state with P_LVL6 I/O support
• Support for Intel® Trusted Execution Technology
• Half ratio support (N/2) for core to bus ratio
1.1
Terminology
Term
Definition
#
A “#” symbol after a signal name refers to an active low signal, indicating a 
signal is in the active state when driven to a low level. For example, when 
RESET# is low, a reset has been requested. Conversely, when NMI is high, 
a nonmaskable interrupt has occurred. In the case of signals where the 
name does not imply an active state but describes part of a binary 
sequence (such as address or data), the “#” symbol implies that the signal 
is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]# 
= “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level). 
Front Side Bus 
(FSB)
Refers to the interface between the processor and system core logic (also 
known as the chipset components).
AGTL+
Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+ 
signaling technology on some Intel processors.
Storage 
Conditions
Refers to a non-operational state. The processor may be installed in a 
platform, in a tray, or loose. Processors may be sealed in packaging or 
exposed to free air. Under these conditions, processor landings should not 
be connected to any supply voltages, have any I/Os biased or receive any 
clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device 
removed from packaging material) the processor must be handled in 
accordance with moisture sensitivity labeling (MSL) as indicated on the 
packaging material.
Enhanced Intel 
SpeedStep® 
Technology
Technology that provides power management capabilities to laptops.
Processor Core
Processor core die with integrated L1 and L2 cache. All AC timing and signal 
integrity specifications are at the pads of the processor core.