Intel Pentium D 940 HH80553PG0884M User Manual

3

Introduction ............................................................................................................ 11
1.1

Terminology ..................................................................................................... 12
1.1.1

Processor Packaging Terminology ............................................................. 12

Electrical Specifications ........................................................................................... 15
2.1

Power and Ground Lands.................................................................................... 15

 Decoupling ...................................................................................... 15

 Decoupling ...................................................................................... 15

Voltage Identification ......................................................................................... 16

Reserved, Unused, and TESTHI Signals ................................................................ 18

DC Voltage and Current Specification ........................................................ 20

FSB Signal Groups.................................................................................. 26

GTL+ Asynchronous Signals..................................................................... 28

Processor DC Specifications ..................................................................... 28
2.6.3.1

GTL+ Front Side Bus Specifications ............................................. 31

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 32

BCLK[1:0] Specifications ......................................................................... 35

Package Mechanical Specifications .......................................................................... 37
3.1

Land Listing and Signal Descriptions ....................................................................... 45
4.1

Alphabetical Signals Reference ............................................................................ 70

Thermal Specifications and Design Considerations .................................................. 81
5.1