Intel Pentium D 940 HH80553PG0884M User Manual
Product codes
HH80553PG0884M
Datasheet
5
Figures
Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream) and
775_VR_CONFIG_05B (Performance) Processors .......................................................... 24
Overshoot Example Waveform ............................................................................. 25
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Pentium
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D Processor 900 Sequence) ........ 42
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Pentium
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Processor Extreme Edition 955,
965)....................................................................................................................... 43
10 Processor Land Coordinates and Quadrants (Top View) ................................................. 44
11 land-out Diagram (Top View – Left Side) ..................................................................... 46
12 land-out Diagram (Top View – Right Side) ................................................................... 47
13 Thermal Profile for 775_VR_CONFIG_05B Processors (Performance) ............................... 83
14 Thermal Profile for 775_VR_CONFIG_05A Processors (Mainstream)................................. 84
15 Case Temperature (TC) Measurement Location ............................................................ 85
16 Processor Low Power State Machine ........................................................................... 92
17 Mechanical Representation of the Boxed Processor ....................................................... 95
18 Space Requirements for the Boxed Processor (Side View: applies to all four side views) .... 96
19 Space Requirements for the Boxed Processor (Top View)............................................... 96
20 Space Requirements for the Boxed Processor (Overall View) .......................................... 97
21 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 98
22 Baseboard Power Header Placement Relative to Processor Socket ................................... 99
23 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
11 land-out Diagram (Top View – Left Side) ..................................................................... 46
12 land-out Diagram (Top View – Right Side) ................................................................... 47
13 Thermal Profile for 775_VR_CONFIG_05B Processors (Performance) ............................... 83
14 Thermal Profile for 775_VR_CONFIG_05A Processors (Mainstream)................................. 84
15 Case Temperature (TC) Measurement Location ............................................................ 85
16 Processor Low Power State Machine ........................................................................... 92
17 Mechanical Representation of the Boxed Processor ....................................................... 95
18 Space Requirements for the Boxed Processor (Side View: applies to all four side views) .... 96
19 Space Requirements for the Boxed Processor (Top View)............................................... 96
20 Space Requirements for the Boxed Processor (Overall View) .......................................... 97
21 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 98
22 Baseboard Power Header Placement Relative to Processor Socket ................................... 99
23 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 1 View) ........................................................................................................ 100
24 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 2 View) ........................................................................................................ 100
25 Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 101
26 Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 102
27 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes..... 103
28 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ..... 104
29 Assembly Stack Including the Support and Retention Module ....................................... 105
30 Boxed Processor TMA Power Cable Connector Description ............................................ 106
31 Balanced Technology Extended (BTX) Mainboard Power Header Placement
26 Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 102
27 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes..... 103
28 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ..... 104
29 Assembly Stack Including the Support and Retention Module ....................................... 105
30 Boxed Processor TMA Power Cable Connector Description ............................................ 106
31 Balanced Technology Extended (BTX) Mainboard Power Header Placement