Intel Pentium D 940 HH80553PG0884M User Manual

Product codes
HH80553PG0884M
Page of 112
Thermal Specifications and Design Considerations
88
Datasheet
5.2.5
THERMTRIP# Signal
Regardless of whether or not Thermal Monitor is enabled, in the event of a catastrophic 
cooling failure, the processor will automatically shut down when the silicon has reached 
an elevated temperature (refer to the THERMTRIP# definition in 
). At this 
point, the FSB signal THERMTRIP# will go active and stay active as described in 
. THERMTRIP# activation is independent of processor activity and does not 
generate any bus cycles.
5.2.6
T
CONTROL
 and Fan Speed Reduction
T
CONTROL
 is a temperature specification based on a temperature reading from the 
thermal diode. The value for T
CONTROL
 will be calibrated in manufacturing and 
configured for each processor. When T
DIODE
 is above T
CONTROL
 then T
C
 must be at or 
below T
C-MAX
 as defined by the thermal profile in 
; otherwise, 
the processor temperature can be maintained at T
CONTROL
 (or lower) as measured by 
the thermal diode.
The purpose of this feature is to support acoustic optimization through fan speed 
control. Contact your Intel representative for further details and documentation.
5.2.7
Thermal Diode
The processor incorporates an on-die PNP transistor whose base emitter junction is 
used as a thermal "diode", with its collector shorted to Ground. A thermal sensor 
located on the system board may monitor the die temperature of the processor for 
thermal management and fan speed control. 
provide the "diode" parameter and interface specifications. Two different sets of "diode" 
. The Diode Model parameters (
) apply 
to traditional thermal sensors that use the Diode Equation to determine the processor 
temperature. Transistor Model parameters (
) have been added to support 
thermal sensors that use the transistor equation method. The Transistor Model may 
provide more accurate temperature measurements when the diode ideality factor is 
closer to the maximum or minimum limits. This thermal "diode" is separate from the 
Thermal Monitor's thermal sensor and cannot be used to predict the behavior of the 
Thermal Monitor. 
NOTES:
1.
Intel does not support or recommend operation of the thermal diode under reverse bias.
2.
Characterized across a range of 50 – 80 °C.
3.
Not 100% tested. Specified by design characterization.
4.
The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by 
the diode equation:
I
FW
 = I
S
 * (e 
qV
D
/nkT
 –1)
where I
S
 = saturation current, q = electronic charge, V
D
 = voltage across the diode, k = Boltzmann 
Constant, and T = absolute temperature (Kelvin).
Table 29.
Thermal “Diode” Parameters using Diode Model
Symbol
Parameter
Min
Typ
Max
Unit
Notes
I
FW
Forward Bias Current
5
200
µA
1
n
Diode Ideality Factor
1.000
1.009
1.050
2, 3, 4
R
T
Series Resistance
2.79
4.52
6.24
Ω
2, 3, 5