Intel Xeon X3440 BX80605X3440 User Manual

Thermal/Mechanical Specifications and Design Guidelines

25

As indicated in 

, access is provided to facilitate manual installation and 

removal of the package. 

To assist in package orientation and alignment with the socket:

• The package Pin 1 triangle and the socket Pin1 chamfer provide visual reference for 

proper orientation.

• The package substrate has orientation notches along two opposing edges of the 

package, offset from the centerline. The socket has two corresponding orientation 
posts to physically prevent mis-orientation of the package. These orientation 
features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the 

package.

 

Pick & Place Cover

Pin 1

ILM Installation

Pick & Place Cover

Pin 1

ILM Installation