Intel Xeon X3440 BX80605X3440 User Manual

26

Thermal/Mechanical Specifications and Design Guidelines

.

Standoffs on the bottom of the socket base establish the minimum socket height after 
solder reflow and are specified in 

Similarly, a seating plane on the top-side of the socket establishes the minimum 
package height. See 

 for the calculated IHS height above the motherboard.

The socket must withstand 20 cycles of processor insertion and removal. The max 
chain contact resistance from 

 must be met when mated in the 1st and 20th 

cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

Pin 1 
Chamfer

Package 
Pin 1 
Indicator

Alignment 
Post
(2 Places)

Finger 
Access
(2 Places) 

Orientation 
Notch
(2 Places)