Intel Xeon X3440 BX80605X3440 User Manual

Thermal/Mechanical Specifications and Design Guidelines

35

This chapter describes the electrical, mechanical, and environmental specifications for 
the LGA1156 socket and the Independent Loading Mechanism.

 provides the stackup height of a processor in the 1156-land LGA package and 

LGA1156 socket with the ILM closed and the processor fully seated in the socket.

1.

This data is provided for information only, and should be derived from: (a) the height of the socket seating 

plane above the motherboard after reflow, given in 

, (b) the height of the package, from the 

package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that 

are given in the corresponding processor datasheet.

2.

The integrated stackup height value is a RSS calculation based on current and planned processors that will 

use the ILM design.

The power dissipated within the socket is a function of the current at the pin level and 
the effective pin resistance. The key temperature limit for the LGA1156 socket is:

• Socket contact interface with package < 100 °C.

Socket Body, Contacts and PnP Cover

10 g

ILM Cover

29 g

ILM Back Plate

38 g

Integrated Stackup Height

 

(mm)

From Top of Board to Top of IHS

7.781 ± 0.335 mm

Socket Nominal Seating Plane Height 

3.4 ± 0.2 mm

Package Nominal Thickness (lands to top of IHS)

4.381 ± 0.269 mm