Intel Xeon X3440 BX80605X3440 User Manual

Thermal/Mechanical Specifications and Design Guidelines

37

LGA1156 socket electrical requirements are measured from the socket-seating plane of 
the processor to the component side of the socket PCB to which it is attached. All 
specifications are maximum values (unless otherwise stated) for a single socket 
contact, but includes effects of adjacent contacts where indicated.

Mated loop inductance, Loop

<3.6nH

The inductance calculated for two contacts, 

considering one forward conductor and one 

return conductor. These values must be satisfied 

at the worst-case height of the socket.

Socket Average Contact Resistance 

(EOL)

19 mOhm

The socket average contact resistance target is 

calculated from the following equation:
sum (Ni X LLCRi) / sum (Ni)

• LLCRi is the chain resistance defined as the 

resistance of each chain minus resistance of 

shorting bars divided by number of lands in 

the daisy chain. 

• Ni is the number of contacts within a chain.
• I is the number of daisy chain, ranging from 

1 to 119 (total number of daisy chains).

The specification listed is at room temperature 

and has to be satisfied at all time.

Max Individual Contact Resistance 

(EOL)

100 mOhm

The specification listed is at room temperature 

and has to be satisfied at all time.
Socket Contact Resistance: The resistance of 

the socket contact, solderball, and interface 

resistance to the interposer land; gaps included.

Bulk Resistance Increase 

≤

 

3 mΩ

The bulk resistance increase per contact from 

25 °C to 100 °C. 

Dielectric Withstand Voltage

360 Volts RMS

Insulation Resistance

800 MΩ