Intel Xeon X3440 BX80605X3440 User Manual

38

Document Number: 424077 Revision: 2.0Thermal/Mechanical 

Specifications and Design Guidelines

. To ensure maximum flexibility for future processors, systems should be 

designed to the Thermal Solution Capability guidelines, even if a processor with lower 
power dissipation is currently planned. 

1.

The package C-state power is the worst case power in the system configured as follows:

- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.

- DMI and PCIe links are at L1.

2.

Specification at DTS = -50 and minimum voltage loadline.

3.

Specification at DTS = -50 and minimum voltage loadline.

4.

Specification at DTS = -64 and minimum voltage loadline.

5.

These DTS values (in Notes 

) are based on the TCC Activation MSR having a value of 100, see 

6.

These values are specified at V

CC_MAX

 and V

NOM

 for all other voltage rails for all processor frequencies. 

Systems must be designed to ensure the processor is not to be subjected to any static V

CC

 and I

CC

 

combination wherein V

CCP

 exceeds V

CCP_MAX

 at specified I

CCP

. Please refer to the loadline specifications in 

the EDS.

7.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at DTS = -1.

TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.

8.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 

frequency requirements. The FMB 2009B (09B) is equivalent to the thermal requirements for the Intel® 

Core™ 2 Quad Q9000 processor series. The FMB 2009A (09A) is equivalent to the thermal requirements for 

the Intel® Core™ 2 Duo E8000 processor series. Reuse of those thermal solutions is recommended with 

the updated mechanical attach to straddle the LGA1156 socket. 

9.

Not 100% tested. Specified by design characterization.

Intel

® 

Xeon

®

 

processor 3400 

series (95W)

2009B

(09B)

28

22

5.5

95

5

 

Intel

® 

Xeon

®

 

processor 3400 

series (45W)

2009A

(09A)

21

17

4.0

45