Intel Xeon X3440 BX80605X3440 User Manual

Product codes
BX80605X3440
Page of 106
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications
38
Thermal/Mechanical Specifications and Design Guidelines
5.6
Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet 
the following environmental reference points.
The reliability targets in this section are based on the expected field use environment 
for these products. The test sequence for new sockets will be developed using the 
knowledge-based reliability evaluation methodology, which is acceleration factor 
dependent. A simplified process flow of this methodology can be seen in 
A detailed description of this methodology can be found at: ftp://download.intel.com/
technology/itj/q32000/pdf/reliability.pdf.
§
Figure 5-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology
 
Establish the
 
market/expected use
 
environment for the
 
technology
 
 Develop Speculative
 
stress conditions based on
 
historical data, content
 
experts, and literature
 
search
 
Perform stressing to
 
validate accelerated
 
stressing assumptions and
 
determine acceleration
 
factors
 
Freeze stressing
 
requirements and perform
 
additional data turns