Intel Xeon X3440 BX80605X3440 User Manual

Product codes

BX80605X3440

1U Collaboration Thermal Solution

1U Collaboration Thermal

Solution

Note:

The collaboration thermal mechanical solution information shown in this document

represents the current state of the data and may be subject to modification.The

information represents design targets, not commitments by Intel.

This section describes the overall requirements for enabled thermal solutions designed
to cool the Intel

Xeon

processor 3400 series including critical to function

dimensions, operating environment and validation criteria in 1U server system.

8.1

Performance Targets

Table 8-1

provides boundary conditions and performance targets for a 1U heatsink to

cool Intel

Xeon

processor 3400 series in 1U server. These values are used to provide

guidance for heatsink design.

Notes:

The values in

Table 8-1

are from final design review.

Max target (mean + 3 sigma) for thermal characterization parameter.

Airflow through the heatsink fins with zero bypass.

Max target for pressure drop (dP) measured in inches H

For 1U collaboration heatsink, see

Appendix B

for detailed drawings.

Table 8-1

specifies

and pressure drop targets at 15.0 CFM.

Figure 8-1

shows Ψ

and pressure drop for

the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent
errors associated with reading the graph.

Table 8-1.

Boundary Conditions and Performance Targets

Processor

Altitude

Thermal

Design

Power

TTV Target

Ψca

Air Flow

Pressure

Drop

Intel

Xeon

Processor 3400

Series(95W)

Sea Level

95W

40°C

0.34W/°C

15CFM

0.383

Intel

Xeon

Processor 3400

Series(45W)

Sea Level

45W

40°C

0.40W/°C

15CFM

0.383