Intel Xeon X3440 BX80605X3440 User Manual

60

Thermal/Mechanical Specifications and Design Guidelines

System validation should focus on ensuring the fan speed control algorithm is 
responding appropriately to the DTS values and T

AMBIENT

 data as well as any other 

device being monitored for thermal compliance. 

Since the processor thermal solution has already been validated using the TTV to the 
thermal specifications at the predicted T

AMBIENT

, additional TTV based testing in the 

chassis is not expected to be necessary.

Once the heatsink has been demonstrated to meet the TTV Thermal Profile, it should be 
evaluated on a functional system at the boundary conditions. 

In the system under test and Power/Thermal Utility Software set to dissipate the TDP 
workload confirm the following item:

• Verify if there is TCC activity by instrumenting the PROCHOT# signal from the 

processor. TCC activation in functional application testing is unlikely with a 
compliant thermal solution. Some very high power applications might activate TCC 
for short intervals this is normal.

• Verify fan speed response is within expectations — actual RPM (Ψ

CA

) is consistent 

with DTS temperature and T

AMBIENT

.

• Verify RPM versus PWM command (or voltage) output from the FSC device is within 

expectations.

• Perform sensitivity analysis to asses impact on processor thermal solution 

performance and acoustics for the following:

— Other fans in the system.
— Other thermal loads in the system.

In the same system under test, run real applications that are representative of the 
expected end user usage model and verify the following:

• Verify fan speed response vs. expectations as done using Power/Thermal Utility SW
• Validate system boundary condition assumptions: Trise, venting locations, other 

thermal loads and adjust models / design as required.