Intel Xeon X3440 BX80605X3440 User Manual

Thermal/Mechanical Specifications and Design Guidelines

9

This document differs from previous Thermal and Mechanical Design Guidelines. In this 
document, mechanical and thermal specifications for the processor and the associated 
socket are now included. The usual design guidance has been retained.

The components described in this document include: 

• The thermal and mechanical specifications for the

— Intel

® 

Xeon

®

 processor 3400 series

• The LGA1156 socket and the Independent Loading Mechanism (ILM) and back 

plate.

• The collaboration design thermal solution (heatsink) for the processors and 

associated retention hardware.

The Intel

® 

Xeon

®

 processor 3400 series has two thermal specifications. When required 

for clarity this document will use Intel

® 

Xeon

®

 processor 3400 series (95W) or Intel

® 

Xeon

®

 processor 3400 series (45W). 

For Workstation segment, since boundary conditions, ILM assembly and reference 

thermal solution etc. are similar to Desktop’s corresponding parts, user could refer to 

Intel

® 

Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket 

Thermal/Mechanical Specifications and Design Guidelines.

When the information is applicable to all products, the this document will use 

“processor” or “processors” to simplify the document.

Material and concepts available in the following documents may be beneficial when 
reading this document.

www.intel.com/Assets/

PDF/datasheet/322371.pdf

www.intel.com/Assets/

PDF/datasheet/322372.pdf

www.intel.com/Assets/

PDF/specupdate/

322173.pdf

www.intel.com/Assets/

PDF/datasheet/322169.pdf

www.intel.com/Assets/

PDF/specupdate/

322170.pdf

www.intel.com/Assets/

PDF/designguide/

322171.pdf

http://

www.formfactors.org/