Intel X5560 AT80602000768AA User Manual

90

Intel

®

 Xeon

®

 Processor 5500 Series Datasheet, Volume 1

The Intel Xeon Processor W5580 (see 

; 

) supports a single Thermal 

Profile. For this processor, it is expected that the Thermal Control Circuit (TCC) would 
only be activated for very brief periods of time when running the most power-intensive 
applications. Refer to the Intel® Xeon® Processor 5500 Series Thermal / Mechanical 
Design Guide (TMDG) for details on system thermal solution design, thermal profiles 
and environmental considerations.

The Intel Xeon processor 5500 series Advanced SKU supports two thermal profiles, 
either of which can be implemented. Both ensure adherence to Intel reliability 
requirements. Thermal Profile A (see 

) is representative of a 

volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink). 
In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be 
activated for very brief periods of time when running the most power intensive 
applications. Thermal Profile B (see 

) is indicative of a constrained 

thermal environment (that is, 1U form factor). Because of the reduced cooling 
capability represented by this thermal solution, the probability of TCC activation and 
performance loss is increased. Additionally, utilization of a thermal solution that does 
not meet Thermal Profile B will violate the thermal specifications and may result in 
permanent damage to the processor. Refer to this processor’s TMDG for details on 
system thermal solution design, thermal profiles and environmental considerations.

The upper point of the thermal profile consists of the Thermal Design Power (TDP) and 
the associated T

CASE

 value. It should be noted that the upper point associated with the 

Intel Xeon processor 5500 series Advanced SKU Thermal Profile B (x = TDP and 
y = T

CASE_MAX_B

 @ TDP) represents a thermal solution design point. In actuality the 

processor case temperature will not reach this value due to TCC activation (see 

 for Intel Xeon processor 5500 series Advanced SKU).

The Intel Xeon processor 5500 series Standard/Basic SKUs (see 

support a single Thermal Profile. For this processor, it is expected that the Thermal 
Control Circuit (TCC) would only be activated for very brief periods of time when 
running the most power-intensive applications. Refer to this processor’s TMDG for 
details on system thermal solution design, thermal profiles and environmental 
considerations.

The Intel Xeon processor 5500 series Low Power SKU (see 

supports a single Thermal Profile. For this processor, it is expected that the Thermal 
Control Circuit (TCC) would only be activated for very brief periods of time when 
running the most power-intensive applications. Refer to this processor’s TMDG for 
details on system thermal solution design, thermal profiles and environmental 
considerations.

The Intel Xeon Processor L5518 and Intel Xeon Processor L5508 both support Thermal 
Profiles with nominal and short-term conditions designed to meet NEBS level 3 
compliance (see 

 respectively). For these SKU’s operation at 

either the nominal or short-term thermal profiles should result in virtually no TCC 
activation.

Analysis indicates that real applications are unlikely to cause the processor to consume 
maximum power dissipation for sustained time periods. Intel recommends that 
complete thermal solution designs target the Thermal Design Power (TDP), instead of 
the maximum processor power consumption. The Adaptive Thermal Monitor feature is 
intended to help protect the processor in the event that an application exceeds the TDP 
recommendation for a sustained time period. For more details on this feature, refer to 

. To ensure maximum flexibility for future requirements, systems should be