Справочник Пользователя для Intel X5560 AT80602000768AA
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AT80602000768AA
Thermal Specifications
90
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
The Intel Xeon Processor W5580 (see
;
) supports a single Thermal
Profile. For this processor, it is expected that the Thermal Control Circuit (TCC) would
only be activated for very brief periods of time when running the most power-intensive
applications. Refer to the Intel® Xeon® Processor 5500 Series Thermal / Mechanical
Design Guide (TMDG) for details on system thermal solution design, thermal profiles
and environmental considerations.
only be activated for very brief periods of time when running the most power-intensive
applications. Refer to the Intel® Xeon® Processor 5500 Series Thermal / Mechanical
Design Guide (TMDG) for details on system thermal solution design, thermal profiles
and environmental considerations.
The Intel Xeon processor 5500 series Advanced SKU supports two thermal profiles,
either of which can be implemented. Both ensure adherence to Intel reliability
requirements. Thermal Profile A (see
either of which can be implemented. Both ensure adherence to Intel reliability
requirements. Thermal Profile A (see
) is representative of a
volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink).
In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive
applications. Thermal Profile B (see
In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive
applications. Thermal Profile B (see
) is indicative of a constrained
thermal environment (that is, 1U form factor). Because of the reduced cooling
capability represented by this thermal solution, the probability of TCC activation and
performance loss is increased. Additionally, utilization of a thermal solution that does
not meet Thermal Profile B will violate the thermal specifications and may result in
permanent damage to the processor. Refer to this processor’s TMDG for details on
system thermal solution design, thermal profiles and environmental considerations.
capability represented by this thermal solution, the probability of TCC activation and
performance loss is increased. Additionally, utilization of a thermal solution that does
not meet Thermal Profile B will violate the thermal specifications and may result in
permanent damage to the processor. Refer to this processor’s TMDG for details on
system thermal solution design, thermal profiles and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated T
the associated T
CASE
value. It should be noted that the upper point associated with the
Intel Xeon processor 5500 series Advanced SKU Thermal Profile B (x = TDP and
y = T
y = T
CASE_MAX_B
@ TDP) represents a thermal solution design point. In actuality the
processor case temperature will not reach this value due to TCC activation (see
for Intel Xeon processor 5500 series Advanced SKU).
The Intel Xeon processor 5500 series Standard/Basic SKUs (see
support a single Thermal Profile. For this processor, it is expected that the Thermal
Control Circuit (TCC) would only be activated for very brief periods of time when
running the most power-intensive applications. Refer to this processor’s TMDG for
details on system thermal solution design, thermal profiles and environmental
considerations.
Control Circuit (TCC) would only be activated for very brief periods of time when
running the most power-intensive applications. Refer to this processor’s TMDG for
details on system thermal solution design, thermal profiles and environmental
considerations.
supports a single Thermal Profile. For this processor, it is expected that the Thermal
Control Circuit (TCC) would only be activated for very brief periods of time when
running the most power-intensive applications. Refer to this processor’s TMDG for
details on system thermal solution design, thermal profiles and environmental
considerations.
Control Circuit (TCC) would only be activated for very brief periods of time when
running the most power-intensive applications. Refer to this processor’s TMDG for
details on system thermal solution design, thermal profiles and environmental
considerations.
The Intel Xeon Processor L5518 and Intel Xeon Processor L5508 both support Thermal
Profiles with nominal and short-term conditions designed to meet NEBS level 3
compliance (see
Profiles with nominal and short-term conditions designed to meet NEBS level 3
compliance (see
respectively). For these SKU’s operation at
either the nominal or short-term thermal profiles should result in virtually no TCC
activation.
activation.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP), instead of
the maximum processor power consumption. The Adaptive Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP), instead of
the maximum processor power consumption. The Adaptive Thermal Monitor feature is
intended to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
. To ensure maximum flexibility for future requirements, systems should be